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| RO-P-DS-3019 A 0.5W X/Ku-Band Power Amplifier 8.0-12.5 GHz Preliminary Information MAAPGM0034-DIE Features 8.0-12.5 GHz GaAs MMIC Amplifier 8.0-12.5 GHz Operation 0.5 Watt Saturated Output Power Level Variable Drain Voltage (4-10V) Operation Self-Aligned MSAG(R) MESFET Process Primary Applications Point-to-Point Radio Weather Radar Military Radar Description The MAAPGM0034-DIE is a 2-stage 0.5 W power amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications. Each device is 100% RF tested on wafer to ensure performance compliance. The part is fabricated using M/A-COM's repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAG(R)) MESFET Process. This process provides polyimide scratch protection. Electrical Characteristics: TB = 40C1, Z0 = 50, VDD = 10V, VGG = -2V, Pin = 18 dBm Parameter Bandwidth Output Power Power Added Efficiency 1-dB Compression Point Small Signal Gain Input VSWR Gate Current Drain Current Output Third Order Intercept Noise Figure 2nd Harmonic 3rd Harmonic Symbol f POUT PAE P1dB G Input VSWR IGG IDD OTOI NF 2f 3f Typical 8.0-12.5 28 35 26 15 2:1 <2 < 200 33 8 -28 -35 mA mA dBm dB dBc dBc Units GHz dBm % dBm dB 1. TB = MMIC Base Temperature RO-P-DS-3019 A 2/6 0.5W X/Ku-Band Power Amplifier Maximum Operating Conditions 1 Parameter Input Power Drain Supply Voltage Gate Supply Voltage Quiescent Drain Current (No RF) Quiescent DC Power Dissipated (No RF) Junction Temperature Storage Temperature Symbol PIN VDD VGG IDQ PDISS TJ TSTG MAAPGM0034-DIE Absolute Maximum 21.0 +12.0 -3.0 190 1.2 180 -55 to +150 Units dBm V V mA W C C 1. Operation outside of these ranges may reduce product reliability. Operation at other than typical values may result in performance outside guranteed limits. Recommended Operating Conditions Characteristic Drain Voltage Gate Voltage Input Power Junction Temperature Thermal Resistance MMIC Base Temperature Symbol VDD VGG PIN TJ JC TB 64.1 Note 2 Min 4.0 -2.3 Typ 10.0 -2.0 18.0 Max 10.0 -1.5 19.0 150 Unit V V dBm C C/W C 2. Maximum MMIC Base Temperature = 150C --JC* VDD * IDQ Operating Instructions This device is static sensitive. Please handle with care. To operate the device, follow these steps. 1. Apply VGG = -2 V, VDD= 0 V. 2. Ramp VDD to desired voltage, typically 10.0 V. 3. Adjust VGG to set IDQ, (approximately @ -2 V). 4. Set RF input. 5. Power down sequence in reverse. Turn gate voltage off last. Specifications subject to change without notice. Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3019 A 3/6 0.5W X/Ku-Band Power Amplifier 50 MAAPGM0034-DIE 50 POUT PAE 40 40 30 30 20 20 10 10 0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 0 13.0 Frequency (GHz) Figure 1. Output Power and Power Added Efficiency vs. Frequency at VDD = 10V and Pin = 18 dBm. 50 POUT PAE 40 40 50 30 30 20 20 10 10 0 4 5 6 7 8 9 10 0 Drain Voltage (V) Figure 2. Saturated Output Power and Power Added Efficiency vs. Drain Voltage at fo = 10 GHz. Specifications subject to change without notice. Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3019 A 4/6 0.5W X/Ku-Band Power Amplifier 50 MAAPGM0034-DIE VDD = 4 VDD = 8 40 VDD = 6 VDD = 10 30 20 10 0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 Frequency (GHz) Figure 3. 1dB Compression Point vs. Drain Voltage 30 GAIN VSWR 25 5 6 20 4 15 3 10 2 5 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 1 13.0 Frequency (GHz) Figure 4. Small Signal Gain and Input VSWR vs. Frequency at VDD = 10V. Specifications subject to change without notice. Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3019 A 5/6 0.5W X/Ku-Band Power Amplifier MAAPGM0034-DIE Mechanical Information Chip Size: 2.480 x 1.580 x 0.075 mm (98 x 62 x 3 mils) 0.990 mm. 2.480 mm. 0.127 mm. 1.580 mm. 1.428 mm. VDD OUT 0.790 mm. 0.790 mm. IN 0.152 mm. 0 0 Figure 5. Die Layout Chip edge to bond pad dimensions are shown to the center of the bond pad. VGG 1.240 mm. 2.353 mm. Bond Pad Dimensions Pad RF In and Out DC Drain Supply Voltage VDD DC Gate Supply Voltage VGG Size (m) 100 x 200 200 x 150 150 x 150 Size (mils) 4x8 8x6 6x6 Specifications subject to change without notice. Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3019 A 6/6 0.5W X/Ku-Band Power Amplifier MAAPGM0034-DIE VDD 0.1 F 100 pF VDD RFIN OUT RFOUT IN 100 pF VGG VGG 0.1 F Figure 6. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization fixture for CW testing. Assembly Instructions: Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 C to less than 5 minutes. Wirebonding: Bond @ 160 C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier. Specifications subject to change without notice. Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Visit www.macom.com for additional data sheets and product information. |
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